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According to Taiwan-based media outlet DigiTimes, suppliers in Taiwan, Japan, South Korea, and China are expanding production capacity for higher-margin, advanced copper-clad laminates (CCLs) in response to supply shortages, but the capacity additions are running behind schedule. Supply-chain sources cited by DigiTimes said Taiwan’s Elite Material Co. (EMC) and South Korea’s Doosan Corporation Electro-Materials BG have each seen their CCL equipment installation schedules delayed by about six months. Construction delays were cited as the cause at EMC, while Doosan’s delay followed a workplace safety incident at a construction site. Taiwan Union Technology (TUC) has also experienced delays. Equipment delivery problems in the second quarter of 2026 pushed back mass production for the second phase of its Thailand plant by roughly two months. Nevertheless, production began in July, with shipments expected to increase from August as the plant ramps up. These delays suggest that high-end CCL shortages and extended lead times are unlikely to ease in the near term. Production capacity for AI server PCB-grade CCL remains concentrated among a small group of Tier 1 suppliers, including Taiwan’s EMC, TUC, and Nan Ya Plastics; Japan’s Panasonic Industry; South Korea’s Doosan; and China’s Shengyi Technology. With upstream material supplies also tight, lead times for high-end CCL have reportedly stretched to four to six months. Supply-chain sources expect Doosan to be the sole supplier of CCL for compute boards during the initial production ramp of Nvidia’s Vera Rubin server platform. Meanwhile, Nan Ya is expected to join Shengyi and EMC in supplying materials for Vera Rubin switch boards.
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