According to Korean press reports, Korean PCB/substrate makers are expected to carry their strong Q2 results into further earnings improvement in Q3. For example, Daeduck Electronics posted revenue of KRW 401.0bn and operating profit of KRW 70.3bn, up 63% and 3,599% YoY respectively. Simmtech reported revenue of KRW 514.6bn and operating profit of KRW 62.9bn, up 51% and 1,035%. TLB also grew, recording revenue of KRW 88.2bn and operating profit of KRW 12.8bn, up 38% and 86% respectively. Daeduck Electronics' strengths lie in semiconductor package substrates (FC-BGA / FC-CSP) and multilayer printed circuit boards (MLB) for AI data centers; Simmtech's in package substrates and memory module PCBs; and TLB's in PCBs for server DDR5 and enterprise solid-state drives (SSDs). Notably, as major players including Taiwan's Unimicron prioritize capacity allocation toward high-value ABF substrates and scale back their BT substrate exposure, there is growing speculation that some of that order flow could shift to Daeduck Electronics and Simmtech, which produce BT substrates for memory and system semiconductors. SOCAMM is emerging as another growth driver. With NVIDIA's next-generation AI platform — the Vera Rubin GPU and Vera CPU — approaching shipment, the demand outlook for SOCAMM PCBs is strengthening, lifting earnings expectations for Simmtech and TLB, both of which supply related products.

According to Korean press reports, Korean PCB/substrate makers are expected to carry their strong Q2 results into further earnings improvement in Q3. For example, Daeduck Electronics posted revenue of KRW 401.0bn and operating profit of KRW 70.3bn, up 63% and 3,599% YoY respectively. Simmtech reported revenue of KRW 514.6bn and operating profit of KRW 62.9bn, up 51% and 1,035%. TLB also grew, recording revenue of KRW 88.2bn and operating profit of KRW 12.8bn, up 38% and 86% respectively. Daeduck Electronics' strengths lie in semiconductor package substrates (FC-BGA / FC-CSP) and multilayer printed circuit boards (MLB) for AI data centers; Simmtech's in package substrates and memory module PCBs; and TLB's in PCBs for server DDR5 and enterprise solid-state drives (SSDs). Notably, as major players including Taiwan's Unimicron prioritize capacity allocation toward high-value ABF substrates and scale back their BT substrate exposure, there is growing speculation that some of that order flow could shift to Daeduck Electronics and Simmtech, which produce BT substrates for memory and system semiconductors. SOCAMM is emerging as another growth driver. With NVIDIA's next-generation AI platform — the Vera Rubin GPU and Vera CPU — approaching shipment, the demand outlook for SOCAMM PCBs is strengthening, lifting earnings expectations for Simmtech and TLB, both of which supply related products.

Source:https://x.com/jukan05/status/2085939743632892184