Samsung aims to complete development of 3D Cube-H, its hybrid bonding technology for 3D logic chips, by early next year, | Hanami
Samsung aims to complete development of 3D Cube-H, its hybrid bonding technology for 3D logic chips, by early next year, according to Korean media reports.
The technology is primarily intended for ultra-high-performance AI chips. Korean media said that if Samsung succeeds, it could strengthen its competitive position in next-generation AI chips and lay the groundwork for winning Big Tech customers for its foundry business.
https://zdnet.co.kr/view/?no=20261110104822