South Korean tech outlet The Elec has published a follow-up report on Terafab with some interesting details. Here are the key takeaways: - ACM Research is looking to supply panel-level packaging equipment to Terafab. Although the company generates 99% of its revenue in China, it has also been an Intel supplier. With an Intel veteran now overseeing Terafab, much of Terafab’s supplier base is similar to Intel’s. The project is moving forward with a 700 × 700 mm panel format. - Terafab is reportedly working with Samsung as well as Intel and TSMC. The partnership is not exclusive to Intel. - Micron reportedly declined to participate in Terafab. - Intel is working with Terafab because it sees the company as a customer rather than a competitor. Intel has yet to secure external foundry customers, so it lacks customer references. It needs to put its technology into actual customer products, refine it, and build confidence in its reliability. In that sense, collaborating with Terafab could be a significant opportunity for Intel. - Industry sources have been impressed by Terafab’s drive. The impression is that the team is serious about the project and determined to make it happen, whatever it takes. - SK hynix will eventually end up working with Terafab as well. - Fabs across Texas are reportedly losing substantial numbers of employees to Terafab, with Tesla seen as the most desirable employer in the state. Many employees have left NXP and Samsung for Terafab, and Samsung has been filling those vacancies by hiring from its suppliers, creating a ripple effect of talent losses across the supply chain.